Fine pitch PCB assembly refers to the process of placing and soldering electronic components with extremely small lead spacing, usually 0.5 mm or less. As modern devices become smaller and more powerful, fine pitch designs are essential for achieving higher circuit density without increasing PCB size. This type of assembly is widely used in advanced electronics such as smartphones, medical devices, industrial control systems, communication modules, and aerospace instruments. Fine pitch PCB assembly requires extreme accuracy, advanced machinery, and a controlled production environment. Any minor misalignment or soldering issue can lead to short circuits, open connections, or device failure. For…
